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ai-hardware
2 postsSide-Stacked Memory Chips Could Solve HBM's Heat Problem
V-Die and MOSAIC arrange DRAM dies side by side instead of stacking them vertically, aiming to solve HBM's heat problem and boost memory bandwidth for AI chips.
Inside Nvidia's Vera CPU and its custom Olympus cores
A technical breakdown of Nvidia's Vera CPU and custom Olympus cores, covering monolithic design, branch prediction, and spatial multithreading.
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