» Tag
dram
2 posts6–Jul 12, 2026
Side-Stacked Memory Chips Could Solve HBM's Heat Problem
V-Die and MOSAIC arrange DRAM dies side by side instead of stacking them vertically, aiming to solve HBM's heat problem and boost memory bandwidth for AI chips.
Memory Scarcity and Open Models Are Reshaping the AI Industry
A new paper models how the DRAM/HBM price crisis, open-weight models, and inference efficiency gains will reshape the AI industry through 2026-2030.