SMIC's third-gen 7nm node shows smaller metal pitch than Intel 18A
SMIC's N+3 7nm technology achieves smaller metal pitch than Intel 18A but lacks in performance.
An analysis of Huawei's Kirin 9030 SoC reveals that SMIC's third-gen 7nm technology achieves a smaller metal pitch than Intel's 18A and matches TSMC's N6 in transistor density without EUV. However, this does not make SMIC's N+3 competitive with Intel's 18A or TSMC's N2 and N3. While SMIC has made progress in density, the Kirin 9030 lags in performance and energy efficiency compared to leading chip designs.
This synthesis was produced from its source by AI; there is no human editor or manual review step. How we work