» Tag
semiconductors
10 postsSide-Stacked Memory Chips Could Solve HBM's Heat Problem
V-Die and MOSAIC arrange DRAM dies side by side instead of stacking them vertically, aiming to solve HBM's heat problem and boost memory bandwidth for AI chips.
Memory Scarcity and Open Models Are Reshaping the AI Industry
A new paper models how the DRAM/HBM price crisis, open-weight models, and inference efficiency gains will reshape the AI industry through 2026-2030.
TSMC Engineer Sentenced to 10 Years, Taiwan's AI Basic Act Lacks Penalties
A former TSMC engineer received a 10-year sentence, while Taiwan's AI law has no penalties.
CommitBrief — AI code reviews, right in your terminal
A provider-agnostic, local-first CLI that reviews your staged changes, a historic range, or a whole GitHub pull request. Zero telemetry, no server. Free and open source.
commitbrief.comOpenAI and Broadcom Unveil Jalapeño, an LLM Inference Chip
OpenAI and Broadcom unveiled Jalapeño, a custom LLM inference chip built in nine months, set for gigawatt-scale data center deployment starting in 2026.
AMD Acquires Taalas to Enhance AI Chip Inference Performance
AMD's acquisition of Taalas aims to boost AI chip performance and compete with Nvidia.
Exploring the 1970s PROM Chip: Data Storage in Microscopic Fuses
The MMI 5300 PROM chip from the 1970s stores 1024 bits in microscopic fuses. Detailed examination and operational principles.
New semiconductor firm TYLsemi secures $43 million in funding
TYLsemi aims to simplify custom silicon development with $43 million in funding.
Creating Your Own V-I Plots at Home: A Tech Note
Discover how to create V-I plots for semiconductor devices using a multimeter and liquid cooling techniques for accurate measurements.
SMIC's third-gen 7nm node shows smaller metal pitch than Intel 18A
SMIC's N+3 7nm technology achieves smaller metal pitch than Intel 18A but lacks in performance.
TSMC confirms significant yield and performance improvements in A14 update
TSMC's A14 fabrication process shows significant yield and performance improvements, attracting strong interest from AI/HPC and smartphone sectors.